Miniaturization of electronic products is developing in a dramatic speed in past decade. Under this circumstance, printed circuit board industries coming up with this trend.
Printed circuit board production development
Single side =>Double side =>Multi-layer=>High Density Interconnection (HDI)
The difficulties of production in printed circuit board increase with the circuit density.
The followings are the comparison of typical capability and the HDI.
| Line Width | >75μm | 65-70μm |
| Line Space | 100μm | 75-100μm |
| Blind Via Diameter | 250μm | 75-200μm |
Uneven distributionIn the production of high density circuit, we have to face the following problem in plating
- Poor throwing power
- Burnt deposits
Pulse plating is the solution that can minimized the difficulties we in the copper plating process.
- To enhance the metal distribution uniformity
- To increase productivity of plating by changing the physical parameter of the plating conditions.
